学习与工作经历： 2012-2016 华南农业大学 农业机械化及其自动化 学士学位 2016-2019 华南农业大学 农业机械化工程 硕士学位 2019-2022 中南大学 机械工程 博士学位 2024-今 任教于广东石油化工学院机电系
科研及教研项目： 参与国自科面上项目《互连微凸点的有限晶粒尺度效应与高频超声能多晶调控》，2020； 参与国自科区域创新发展联合基金项目（广东省）《高密度器件智能制造的基础科学问题研究》，2020； 参与国家重点研发计划《MBE装备多场多尺度模拟仿真、设计优化与生长机理研究》，2022
公开发表的论文： 1. Jinqing Xiao, Fuliang Wang, Junhui Li*, Zhuo Chen*. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders[J]. Applied Surface Science, 2023, 625: 157219. 2. Jinqing Xiao, Junhui Li*, Effects of Kovar-4J29 cylinder resonance on ultrasonic wire bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, 11(1): 153-160. 3. 萧金庆，李军辉. 基于有限元模拟的三维集成微系统热循环可靠性研究[J]. 导航与控制，2022，21：Z1. 4. Jinqing Xiao, Ruijun Ma, Chen Yu. Effects of test levels on creep and relaxation characteristic parameters of stem for rice seedlings grown in plastic cell tray[J]. International Journal of Agricultural and Biological Engineering, 2020, 13(4), 19-28. 5. Yangtao Long; Ziye Di; Chenhao Lu; Wenya Tian; Long Dou; Zhong Jin; Jinqing Xiao*; Junhui Li*. High-G shock reliability of 3-D integrated structure microsystem based on finite element simulation[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, 11(8): 1243-1249. 6. Peiyuan Lu; Yongshuan Wu; Tianxiang Wu; Wenya Tian; Long Dou; Jinqing Xiao*; Junhui Li*. Ultrasonic-assisted micro-silver paste sintering for flip-chip bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, 12(8): 1395-1400. 7. Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao*, Junhui Li*. Design and fabrication of leadless package structure for pressure sensors[J]. Journal of Electronic Packaging, 2022, 144(4): 041005. 8. Tianxiang Wu, Yongshuan Wu, Wenya Tian, Long Dou, Jinqing Xiao*, Junhui Li*. A single-vision dual imaging optical system in flip chip alignment[J]. Optik, 2023, 277: 170702.
个人荣誉： 2021年获第二届微系统与先进封装仿真大赛特等奖 |
